www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: i nfo@shoulder.cn page 1 of 5 s pec n o : ? ? s s p p e e c c i i f f i i c c a a t t i i o o n n customer product ? saw filter model no hdf 40 2 a f11 prepared checked approved ? d a t e 200 6 - 5 - 11 ??? shoulder electronics limited ?? c ustomer received: c hecked ? approved d ate
saw filter hdf 40 2 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: i nfo@shoulder.cn page 2 of 5 ?? history record date spec . no . ?? part no . ??? customer no . modify content ? remark
saw filter hdf 40 2 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: i nfo@shoulder.cn page 3 of 5 1. scope this specification shall cover the characteristics of saw filter with f40 2 a used for the page system. 2. electrical specification dc voltage vdc 10v ac voltage vpp 10v50hz/60hz operation temperature - 4 0 to + 85 storage temperature - 45 to +85 rf power dissipation 0dbm electronic characteristics 2 - 1.typical frequency response 2 - 2.electrical characteristics part number f40 2 a unit nominal center frequency (fo) 40 2 mhz insertion loss 1.fo - 45.8~fo - 39.8 mhz 50min. db 2.fo 3.0 mhz 4.0max. 3.fo +39.8~ fo +45.8mhz 45min. ripple (with fo 3.0mhz) 2.0max db input/output impedance(nominal) 50//0 /pf
saw filter hdf 40 2 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: i nfo@shoulder.cn page 4 of 5 3. test circuit 4. dimension
saw filter hdf 40 2 a f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: i nfo@shoulder.cn page 5 of 5 5. environmental characteristics 5 - 1 high temperature exposure subject the device to +85 for 16 hours. then release the filter into the room conditions for 24 hours prior to the measurement. it shall fulfi ll the specifications in 2 - 2 . 5 - 2 low temperature exposure subject the device to - 4 0 for 16 hours. then release the device into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 2 - 2 . 5 - 3 temperature cy cling subject the device to a low temperature of - 40 for 30 minutes. following by a high temperature of +8 5 for 30 minutes. then release the device into the room conditions for 24 hours prior to the me a surement. it shall meet the specifications in 2 - 2 . 5 - 4 resistance to solder heat dip the device terminals no closer than 1.5mm into the solder bath at 260 10 for 10 1 sec. then release the device into the room conditions for 4 hours. the device shall meet the specifications in 2 - 2 . 5 - 5 solderabilit y subject the device terminals into the solder bath at 245 5 for 5s, more than 95% area of the terminals must be covered with new solder. it shall meet the specifications in 2 - 2 . 5 - 6 mechanical shock drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2 - 2 . 5 - 7 vibration subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the device shall fulfill the specificatio ns in 2 - 2 . 6. remark 6.1 static voltage static voltage between signal load & ground may cause det e rioration &destruction of the component. please avoid static voltage. 6.2 ultrasonic cleaning ultrasonic vibration may cause det e ri oration & destruction of the component. please avoid ultrasonic cleaning 6.3 soldering only leads of component may be soldered. please avoid soldering another part of component.
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